产品与市场
S1150GH
特点
● 无铅兼容及优异的耐离子迁移性能
● 低的Z轴热膨胀系数
● 适用高端HDI性能加工需求
应用领域
● 消费电子
● 智能手机,平板电脑,笔记本
● LED,游戏设备
- 产品性能
- 产品证书
- 资料下载
Items | Method | Condition | Unit | Typical Value | ||
---|---|---|---|---|---|---|
Tg | IPC-TM-650 2.4.24.4 | DSC | ℃ | 160 | ||
|
|
DMA |
℃ |
170 | ||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 400 | ||
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | ||
After Tg | ppm/℃ | 189 | ||||
50-260℃ | % | 2.3 | ||||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | ||
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | ||
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | pass | ||
Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ.cm | 6.0 x 108 | ||
Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 8.0 x 107 | ||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 148 | ||
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | ||
Dissipation Constant (Dk) RC50% |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.30 | ||
Dissipation Factor (Df) RC50% | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.010 | ||
Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 |
|
N/mm | 1.35 | ||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 | |
CW | IPC-TM-650 2.4.4 | A | MPa | 430 | ||
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.09 | ||
Flammability | UL94 | C-48/23/50 | Rating | V-0 | ||
E-24/125 | Rating | V-0 |
Remarks:
Remark:
1. All the typical value is based onthe 1.6mm (8*7628) specimen. The Dk and Df value is based on 50% RC.
2. All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.
Explanations:C=Humidity conditioning; D=Immersion conditioning in distilled water;E=Temperature conditioning.
The figures following the letter symbolsindicate with the first digit the duration of the preconditioning in hours,with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.