产品与市场
SF215C
特点
●透明度低，遮光性佳。
●阻燃性达到UL94 V-0级。
●优秀的耐热性、耐化学性和电性能。
●溢胶量低，加工性好，适于快速压合和传统压合。
●满足RoHS指令要求，不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。
应用领域
挠性印制电路板用覆盖膜- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 0.71 |
| 288℃, 5s | 0.7 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability | SY Method |
After peeling off the paper |
% | -0.0304/-0.0151 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞85 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
4.1×108 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
1.2×105 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 4.22 |
| Dissipation Factor (10GMHz) | SPDR |
C-24/23/50 |
- | 0.0405 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | ＜0.15 |
| Flammability | UL94 |
E-24/125 |
Rating |
V-0 |