产品与市场
SH260
特点
● Polyimide system
● Ultra-high thermal performance
● Tough resin system, Non-MDA chemistry
● Maintain mechanical strength and bonding strength at high temperature
● Halogen-free, chemistry and lead-free compatible
● RoHS/WEEE compliant
应用领域
Burn-in Board
Down Hole
Aircraft and
Aerospace
Other PCB
requirements to work under high temperature for long time
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24 | TMA | ℃ | ＞250 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 429 |
| T300 |
2.4.24.1 |
TMA |
min |
＞60 |
| CTE (Z-axis) | 2.4.24 | 50-260℃ (X/Y) | ppm/℃ | 12-15 |
| α1 (before Tg) | ppm/℃ | 45 | ||
| 50-260℃ | % | 1.20 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 4.12 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.007 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 7.45 x 107 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 4.79 x 107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 180 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 40.5 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm[lb/in] | 1.37[7.83] |
| Flexural Strength | 2.4.4 | 50℃/260℃ | MPa |
530/439 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.26 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
HB |
Remarks:
1. Specimen thickness: 1.6mm. Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.